Lorom

Complete Manufacturing

[Home cable Assemblies] [Home Power Cords]
post

QSFP+

By

Quad Small Form Factor Pluggable Plus – 40 Gbps Interconnect System

Transmission speeds are continuing to rise as consumers demand ever higher performance from a variety of communications devices. New trends, based computing, where there is a need for seamless access to large data centers are driving significant growth in bandwidth requirements.

LOROM’s unique offering of precision external QSFP+ cable assembly solutions provides a complete product platform addressing and providing unique value propositions to these difficult challenges. The QSFP+ cable assembly product platform provides a cost-effective, high-speed solution that meets and exceeds the bandwidth requirements of current and future applications in servers and external storage systems.

This unique product offering exceeds the performance requirements specified to SFF-8436, 10 G Ethernet IEEE 802.3ba, Fibre Channel, InfiniBand QDR, SAS and SONET/SDH standards with different data rate options.

LOROM QSFP+ cable assemblies comprise the use of unique world-class, state-of-the-art , in-house developed E-MAXX® bulk cable, providing the highest level of signal integrity performance.

In particular, extremely low-insertion loss due to our unique skin-foam-skin, gas-injected dielectric technology as well as extreme control of balanced/unbalanced (Mode conversion), providing significant performance advantages in increased system head-room/budget, as well as ease of cable management and smaller packaging densities.

The cable assemblies employ new innovative PCB technology designed specifically to address the complex issues of optimising signal integrity performance. In particular, cross talk as well as launch condition between wire and PCB termination to optimise return loss and prevent/minimize “ringing” effects.

Our highly automated, controlled cable assembly manufacturing processes using the world’s first automatic soldering process, optimises the critical termination between wire and PCB, improving overall performance and removing the human element.

Automated final-test and quality systems assure high-quality cable assemblies, conforming to the high-speed electrical performance requirements in industry specifications. Excellence of mechanical design exceeds the stringent mechanical interface requirements as defined by applicable industry standards.

Features and Benefits

Applications

  • Data Servers
  • Networked Storage Systems
  • Routers
  • External Storage Systems
  • High Performance Computing (HPC) Applications, Data Centre Networking
  • Communications Switches
  • Industry Standards Infiniband Trade Association (IBTA)
  • IEEE802.3ba 40 Gigabit Ethernet (40g BASE – CR4)

Mechanical Advantages

  • Smallest die-cast backshell in the market
  • Suypports “belly-to-belly” configurations
  • Positive latching mechanism
  • Robust cable strain-relief system isolates cable termination from mechanical stress
  • Reduced backshell protrusion provides short cable exit
  • Choice of boss stub implementation
  • Choice of screws or rivets

Signal Integrity

  • Paddle-card design utilising proprietary board material, provides class insertion loss
  • Paddle-card optimised for best-in-class PSNEXT (Crosstalk)
  • Signal integrity and mechanical performance
  • Controlled wire management and termination process assures consistent high-speed electrical performance
  • Active equalised options with CDR, up to 15 m cable length
  • Excellent EMI shielding performance due to die-cast shell design and 360° cable shielding
  • EEPROM for cable signature & system communications
  • ILD (Insertion Loss Deviation) and ICN (Integrated Crosstalk Noise)

E-MAXX® Bulk Cable

  • 32 AWG to 24 AWG cable sizes available; silver-plated conductors with controlled skin effects
  • Ultra-low insertion loss due to E-MAXX® bulk cable
  • “Best-in-class” mode conversation (balance) due to proprietary manufacturing processes and equipment
  • Up to 30% reduction in outside diameter due to skin-foam-skin dielectric technologies (foam vs. solid) Bandwidth in excess of 13 GHz (20 Gbps)
  • UL CL2 rated low smoke zero halogen and PVC
  • UL CMP (plenum-rated version on request)

Features and Benefits

  • Fully compliant with all relevant SFF and IEEE Specifications
  • All cables assemblies undergo 100% with all S-Parameters recorded and filed
  • RoHS Compliant

Applicable Industry Standards

  • SFF-8436
  • SFF-8074i, SFF-8431
  • IEEE 802.3 Gigabit-Ethernet standard
  • QSFP+ Copper and Optical Modules
  • SFP Small Form Factor Pluggable Transeiver rev 1.0 Enhanced SFF Pluggable

LOROM’s Unique Selling Points

Choice of Screws or Rivets

  • The use of screw enables accurate torque in the assebly of the back shell
  • Back shelll can NOT be opened even though screws are selected due to over moulded strain relief, eliminates potential product liability issues

Boss Stub

Choice with SFF Boss stub or not, implemented in the tool development.

Excellence in Signal Integrity

  • The R&D team has applied the latest PCB technology in the quest of lowering the inherently relatively poor insertion loss in I/O assemblies. A full year of development and refining the PCB in an optimal trade-off between low insertion loss and low crosstalk is indeed a challenge and a true black art
  • LOROM is proud to announce the best performing QSFP to the market place with exceptionally good ICR, (Insertion loss to Crosstalk Ratio) providing increased system budget, smaller physical size, as well as longer cable assembly length
  • Tech facility in Shenzhen

Technical Data

Physical

  • Shells: die-cast zinc–nickel-plated
  • PCB: proprietary material laminate with gold-plated contact pads
  • Raw cable: 8 individually shielded differential pair cables
  • Shield: -65 dB coupling attenuation 10 MHz to 3 GHz 360° fully shielded EMI shield
  • Jacket: PVC or LS0H[low smoke zero halogen] CL2 or AWM style or CMP upon request
  • Pull-tab: nylon resin
  • Latch mechanism: die-cast zinc

Electrical Performance

  • Differential Impedance: 100 O +/- 5 O @ 30 ps rise time (20-80%)
  • Insertion Loss: dependent on cable type
  • Near-end multi-line crosstalk: [typical]
    • < 50 dB from 10 MHz to 3 GHz
    • < 40 dB from 3 GHz to 7 GHz
    • < 25 dB from 7 GHz to 10 GHz
  • Mode conversion: < 28 dB from 10 MHz to 10 GHz
  • Within pair skew: < 10 ps / meter
  • Pair-to-pair skew: < 50 ps / meter
  • Withstanding voltage: 300V DC
  • Current rating: 0.5 amps maximum per contact
  • EMC: -65 dB from 10 MHz to 3 GHz

Mechanical Performance

  • Durability: 250 Cycles
  • Mating force (with PCB): 40 N maximum
  • Cable axial pull force: 90 N minimum

Environmental

  • Operating temperature: -20°C to 80°C
  • RoHS Compliant
  • Thermal shock: EIA 364-32, Condition VII, 10 Cycles, -55°C to +85°C
  • Temperature life: EIA 364-17, Method A456 hours +90°C
  • Mixed Flowing gas: EIA 364-65, Class IIA -7 days unmated and 7 days mated

 QSFP+ to 4SFP+

Advantages

LOROM QSFP+ to 4SFP+ Breakout cables addresses the data centre market with an unique high performance cable and a compact design.

  • Customised design
  • Excellence EMI gasket to assure cage shielding to chassis
  • RoHS compliant
  • According to SFF standard