Jay Diepenbrock Joins the High Speed interconnect Team

LOROM Expands the High Speed Cable R&D Team, Welcoming Jay Diepenbrock to the Team as Senior VP of Signal Integrety.

In continuation of the product development of LOROM’s high performance – high speed EMaxx cable assemblies, we are proud to welcome a world-recognized leader, Mr. Jay C. Diepenbrock to our Signal integrity team.

Mr. Diepenbrock in-depth industry knowledge and experience in Signal integrity will excel LOROM’s ability to respond with cable interconnect solutions to the markets need for ever increasing bandwidth, not only in 25GBPS, but more importantly in the development of the company’s technology platforms for 100GBPS and beyond.

Mr Diepenbrock will in his capacity as Senior VP of Signal integrity lead the R&D team and SI labs in Cary North Carolina, Germany, Taiwan and China.

Joseph C. (Jay) Diepenbrock received the Sc. B. and M. S. degrees in electrical engineering from Brown University, Providence, RI, and Syracuse University, Syracuse, NY, respectively.

Mr. Diepenbrock has worked for 36 years in a number of areas in IBM including bipolar and CMOS IC design, analog and digital circuit design, backplane design and simulation, and network hardware and server product development.

During the last 15 years a Senior Technical Staff Member in the Interconnect Technology group in IBM’s Integrated Supply Chain, working on the specification, electrical testing, and modeling of connectors and cables.

He has contributed to a number of industry standards including USB, EIA 364 Test Methods, InfiniBand, 40-100 GBPS IEEE802.3 initiative and PCI-express, has authored or co-authored a numerous of papers at technical conferences and holds eleven patents.

He is a Senior Member of the IEEE and its EMC and Components, Packaging and Manufacturing Technology Societies.

In his spare time he enjoys making and listening to jazz music, bicycling, woodworking, amateur radio, photography and Christian fellowship.